The AnandTech Podcast, Episode 36: Mobile World Congress 2016, Snapdragon 820 and Exynos 8890

AnandTech Podcast #36: The annual smartphone extravaganza known as Mobile World Congress has come and gone. We clocked up 45.4km on foot during the week, averaging around five hours sleep and one meal a day to be able to see everyone of interest. Because so many interesting things were presented, from LG, Samsung, Huawei, Xiaomi and others, just before we left Barcelona Andrei and I put together a podcast of details, experience and analysis of the new devices. There are plenty of talking points with each of them, from a modular design to heatpipes to new silicon microarchitectures, and we recorded our initial impressions in a podcast.

The AnandTech Podcast – Episode 36
Featuring

•  Dr Ian Cutress, Host, Senior Editor (@IanCutress)
•  Andrei Frumuşanu, Mobile Editor (@andreif7)

iTunes
RSS – mp3, m4a
Direct Links – mp3, m4a

Total Time:  1 hour 04 minutes 34 seconds

Outline mm:ss

00:00 – Intro
00:38 – LG G5
08:04 – Samsung Galaxy S7/S7 Edge
15:35 – Some thoughts about heatpipes on smartphones
17:27 – Details on 8890, thoughts on turbo mode on SoCs
22:40 – Waterproofing on S7/S7e
26:13 – Camera on S7/S7e
28:43 – Xiaomi Mi 5
42:32 – There’s a low bin of the Snapdragon 820
44:25 – HTC Vive Pricing
48:21 – Cat S60
52:23 – LG VR
58:49 – Huawei Matebook
1:04:24 – FIN

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