The AnandTech Podcast, Episode 45: GlobalFoundries and Fab 8

In early February, GlobalFoundries did something completely unexpected: for the second time in ten years, they invited a few select press and analysts to visit one of their fabrication plants (‘fabs’), where they make AMD processors, IBM s…

The AnandTech Podcast, Episode 37: IDF 2016, Alloy, Joule, Broxton, and AMD Zen

Today’s podcast covers the show known as the Intel Developer Forum, or IDF for short. IDF is an annual event focusing on new Intel technologies and product visions, showcasing what is new from small maker-like ‘Internet of Things’ devices all the way up to server platforms and everything in-between. Ian and Ryan were at the show, with plenty of meetings on tap. We found some time to put our thoughts on the announcements in a microphone.

The AnandTech Podcast #37: IDF 2016

The AnandTech Podcast – Episode 37
Featuring

•  Dr Ian Cutress, Host, Senior Editor (@IanCutress)
•  Ryan Smith, Editor-in-Chief, (@RyanSmithAT)

iTunes
RSS – mp3, m4a
Direct Links – mp3, m4a

Total Time:  47 minutes 57 seconds

Outline mm:ss

00:00 – Start
01:20 – Intel IDF Keynote
01:40 – Project Alloy, Untethered VR
08:13 – Intel Joule IoT Platform
15:35 – Intel Broxton SoC
20:50 – Knights Landing
22:15 – Knights Mill
25:20 – AMD Zen
37:40 – AMD Naples
47:57 – FIN

Related Reading

IDF 2016 Keynote Live Blog
Intel Announces Project Alloy: Untethered Augmented Reality in a VR Headset
Intel Unveils Joule: A High-Performance Atom-Powered IOT Module and Maker Kit
More Details on Broxton: Quad Core, ECC, Up to 18 EUs of Gen 9
Intel Announces Knights Mill: A Xeon Phi for Deep Learning

AMD Zen Microarchitecture Part 1: Micro-op Cache, Schedulers and Memory Hierarchy
AMD Zen Microarchitecture Part 2: Extracting ILP, More Juicy Details
AMD Zen Server CPU and Motherboard Breakdown: 2P for Q2 2017
Unpacking AMD’s Zen Benchmark: Is Zen actually 2% Faster than Broadwell?

The AnandTech Podcast, Episode 36: Mobile World Congress 2016, Snapdragon 820 and Exynos 8890

AnandTech Podcast #36: The annual smartphone extravaganza known as Mobile World Congress has come and gone. We clocked up 45.4km on foot during the week, averaging around five hours sleep and one meal a day to be able to see everyone of interest. Because so many interesting things were presented, from LG, Samsung, Huawei, Xiaomi and others, just before we left Barcelona Andrei and I put together a podcast of details, experience and analysis of the new devices. There are plenty of talking points with each of them, from a modular design to heatpipes to new silicon microarchitectures, and we recorded our initial impressions in a podcast.

The AnandTech Podcast – Episode 36
Featuring

•  Dr Ian Cutress, Host, Senior Editor (@IanCutress)
•  Andrei Frumuşanu, Mobile Editor (@andreif7)

iTunes
RSS – mp3, m4a
Direct Links – mp3, m4a

Total Time:  1 hour 04 minutes 34 seconds

Outline mm:ss

00:00 – Intro
00:38 – LG G5
08:04 – Samsung Galaxy S7/S7 Edge
15:35 – Some thoughts about heatpipes on smartphones
17:27 – Details on 8890, thoughts on turbo mode on SoCs
22:40 – Waterproofing on S7/S7e
26:13 – Camera on S7/S7e
28:43 – Xiaomi Mi 5
42:32 – There’s a low bin of the Snapdragon 820
44:25 – HTC Vive Pricing
48:21 – Cat S60
52:23 – LG VR
58:49 – Huawei Matebook
1:04:24 – FIN