MSI on Thursday published the first image of a new desktop motherboard that supports the innovative DDR5 compression attached memory module (CAMM2). DDR5 CAMM2 modules are designed to improve upon the SO-DIMM form factor used for laptops, alleviating some of the high-speed signaling and capacity limitations of SO-DIMMs while also shaving down on the volume […]
Intel’s Meteor Lake series of processors has had a drawn-out launch since its details were officially presented in September 2023. The series marks Intel’s foray into the consumer market with a tile-based chiplet configuration held together with Foveros packaging. Similar to Tiger Lake, the focus of Meteor Lake has primarily been on the mobile market […]
As announced last week by TSMC, later this year the company is set to start high-volume manufacturing on its N3P fabrication process, and this will be the company’s most advanced node for a while. Next year things will get a bit more interesting as TSMC will have two process technologies that could actually compete against […]
At its European Technology Symposium last week TSMC revealed some of the details about its Global Gigafab Manufacturing program, the company’s strategy to replicate its manufacturing processes across its multiple gigafab sites. The need for large-scale multi-national fabs to have a process in place to replicate their facilities is well-documented at this point. […]
Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC’s chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS […]