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AMD Slims Down Compute With Radeon Pro W7900 Dual Slot For AI Inference

AMD Slims Down Compute With Radeon Pro W7900 Dual Slot For AI Inference

While the bulk of AMD’s Computex presentation was on CPUs and their Instinct lineup of dedicated AI accelerators, the company also has a small product refresh for the professional graphics and workstation AI crowd. AMD is releasing a dual-slot version of their high-end Radeon Pro W7900 card – aptly named the W7900 Dual Slot – […]

AMD Launching New CPUs for AM4: Ryzen 5000XT Series Coming in July

AMD Launching New CPUs for AM4: Ryzen 5000XT Series Coming in July

During their opening keynote at Computex 2024, AMD announced their intention to launch a pair of new Ryzen 5000 processors for their legacy AM4 platform. The new chips, both getting the XT suffix, will be the Ryzen 9 5900XT, a 16 core Zen 3 part, while the Ryzen 7 5800XT will be an 8 core […]

AMD Plans Massive Memory Instinct MI325X for Q4'24, Lays Out Accelerator Roadmap to 2026

In a packed presentation kicking off this year’s Computex trade show, AMD CEO Dr. Lisa Su spent plenty of time focusing on the subject of AI. And while the bulk of that focus was on AMD’s impending client products, the company is also currently enjoying the rapid growth of their Instinct lineup of accelerators, with […]

Computex 2024 Keynote Preview: The Great PC Powers Convene

The annual Computex computer expo kicks off in Taepei this weekend. And this year’s show is shaping up to be the most packed in years. Computex rivals CES for the most important PC trade show of the year, and in most years is attended by not only the numerous local Taiwanese firms (Asus, MSI, ASRock, […]

TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

TSMC's 3D Stacked SoIC Packaging Making Quick Progress, Eyeing Ultra-Dense 3μm Pitch In 2027

TSMC’s 3D-stacked system-on-integrated chips (SoIC) advanced packaging technologies is set to evolve rapidly. In a presentation at the company’s recent technology symposium, TSMC outlined a roadmap that will take the technology from a current bump pitch of 9μm all the way down to a 3μm pitch by 2027, stacking together combinations of A16 and N2 […]