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The Be Quiet! Dark Power Pro 13 1300W ATX 3.0 PSU Review: Flagship Quality, Flagship Price

Having reviewed and dissected almost a dozen ATX 3.0 power supplies in the last year, thus far we’ve seen an interesting mix in design pedigrees for PSUs targeting the newest power standard. For some manufacturers this has meant bringing up entirely new PSU designs by OEMs new and old, developing fresh platforms to accommodate the […]

TACC's Stampede3 Supercomputer Uses Intel's Xeon Max with HBM2E and Ponte Vecchio

TACC's Stampede3 Supercomputer Uses Intel's Xeon Max with HBM2E and Ponte Vecchio

The Texas Advanced Computing Center (TACC) unveiled its latest Stampede supercomputer for open science research projects, Stampede3. TACC anticipates that Stampede3 will come online this fall and will deliver its full performance in early 2024. The supercomputer will be a crucial component of the U.S. National Science Foundation’s (NSF) ACCESS scientific supercomputing ecosystem, and it […]

Intel Unveils AVX10 and APX Instruction Sets: Unifying AVX-512 For Hybrid Architectures

Intel Unveils AVX10 and APX Instruction Sets: Unifying AVX-512 For Hybrid Architectures

Intel has announced two new x86-64 instruction sets designed to bolster and offer more performance in AVX-based workloads with their hybrid architecture of performance (P) and efficiency (E) cores. The first of Intel’s announcements is their latest Intel Advanced Performance Extensions, or Intel APX as it’s known. It is designed to bring generational, instruction set-driven improvements to […]

Crucial X9 Pro and X10 Pro High-Performance Portable SSDs Announced

Crucial X9 Pro and X10 Pro High-Performance Portable SSDs Announced

Crucial’s X6 and X8 Portable SSDs have been attractive budget options for the mainstream consumers looking to purchase high-capacity direct-attached storage drives. The company has been delivering some industry-firsts in these drives. However, these drives use QLC and are not particularly attractive for power users (such as content creators) who require writing vast amounts of […]

TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging

TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging

TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that will employ some 1,500 people when it becomes operational several years from now. “To meet market needs, TSMC is planning to establish an advanced […]