Mobile


Intel Proposes to Use USB Type-C Digital Audio Technology

Intel Proposes to Use USB Type-C Digital Audio Technology

USB Type-C has a number of chances to become the standard for data and charging connector for smartphones and tablets running either Android or Windows. However, in the long-term future, Intel wants USB-C to be even more universal (and therefore pervasive) than it is going to be, which is why at IDF Shenzhen part of one of the talks evolved around using Type-C for audio.

Audio receptacles on PCs and mobile equipment are virtually the last remaining analog interfaces of modern devices, requiring certain techniques to maintain a high audio quality and remove interference. Intel proposes to replace things like 3.5 mm mini-jack with USB Type-C which will help to add features to headsets and will simplify connections of multi-channel audio equipment to various gadgets. This is not the first time a company has proposed to replace analog audio on PCs and mobile devices, but so far, nobody has succeeded due to the ubiquity of 3.5mm. Since the industry may still not be ready to go all-digital, there seems to be a backup plan.

Various types of audio jacks to connect headphones to audio equipment have been around for decades. For example, the original 6.35 mm connector, which is still widely used by audio equipment, was invented in 1878. Meanwhile, two-conductor miniature 3.5 mm audio connector (which is the most widely used audio connector at present) has been around since 1960s. Headphone jacks have evolved; they have gained contacts to support microphones and even basic programmable capabilities to enable remote controls. However, fundamentally, the ability to listen to audio through a speaker has remained the same for over a hundred years: completely analog and barely any smart functionality. Today’s smartphones are used for all sorts of different purposes and are connected to a variety of devices, which requires sophisticated interconnection technologies with high data-rates. At the same time, as phones and devices get thinner, or even to simplify some of the internal design, it gets harder to install multiple ports for various purposes. If there were to be a universal connector that does it all, including audio, Intel and some other players want USB Type-C to be that universal connector.

In fact, USB-C can be used to transfer analog audio in accordance with the specification of the connector. It all comes down as to how that audio is transmitted.

The USB-C has sideband use pins (SBU1 and SBU2) which can be used for analog audio in audio adapter accessory mode. Use of the sideband pins should not impact data transfers and other vital functionality of USB-C cables, which should make them relatively simple from the engineering point of view. In this case, the USB-C connector will just replace the 3.5 mm mini jack and may even gain some additional features, such as a thermal sensor in an earpiece could measure temperature for fitness tracking.

The concept is not completely new and we saw it years ago – back in the 2000s, Motorola used the mini-USB connector on its feature phones to enable charging, data transfers and a headset connection. The idea to use one connector for everything was not entirely bad, however, it left users without a choice of headsets. However, if the makers of devices (as well as producers of audio listening equipment) adopt USB-C, the is potential that the problem will not occur again. In the advent of digital signal transfer, this allows the headset to drive the digital-to-analog conversion, removing electronic interference from the host and potentially offering a wide array of audio results.

However, transferring analog audio using USB-C’s SBU pins is not the only thing that Intel is working on.

At present, Intel is finalizing the USB Type-C Digital Audio technology and plans to release its specification later in Q2. The company does not reveal a lot about the standard right now, but notes that it is working on updating the USB Audio Device Class 2.0 specifications to support new connector, expand the list of recent audio specifications and features, improve power management and simplify the discovery and configuration model to make the upcoming headsets as easy to use as today’s headsets.

In fact, one of the important issues with streaming audio over USB is the synchronization of data streams from the host to the receiver. The USB Audio Device Class specification solved the problem in the past and because Intel mentioned the USB Audio Device Class 2.0 in its presentation at IDF, this may mean that the new the USB-C Digital Audio spec will rely on this synchronization mechanism as well. Intel wants its USB-S Digital Audio to be backward-compatible with USB Audio (1.0 and 2.0), but naturally plans to add support for new music formats.

Usage of digital audio means that headsets should gain their own amplifiers, DACs and various other logic, which is currently located inside smartphones. Intel proposes to install special multi-function processing units (MPUs), which will perform beam forming, noise suppression, acoustic echo suppression (AES), acoustic echo cancellation (AEC), non-linear processing and other operations. The MPUs will also support HDCP technology, hence, it will not be possible to make digital copies of records using USB-C digital headset outputs. It is unlikely that audio processing will be offloaded to external headsets completely, but the latter will clearly gain their own chips. This may, however, see a spike in cost, especially at the super-low end.

A good thing about USB Type-C headsets with MPUs is that they are going to be software upgradeable and could gain functionality over their lifespan. Intel admits that such MPUs will make digital headsets more expensive compared to analog devices, but high volumes and new process technologies will help to reduce the cost of digital headsets over time. In fact, USB Audio headsets and audio chips for them are not something completely new. For example, Plantronics Audio 655 DSP headset costs $49.99, whereas CMedia’s HS-100 chip for headsets is available $1. Therefore, from the cost perspective, digital headphones should not be too much more expensive in general. Meanwhile, Intel wants USB-C digital audio headsets to offer “significant value at higher end” and have improved functionality in a bid to become popular among consumers.

The industry has successfully replaced analog cables with HDMI for video equipment in the living room and in the coming years will retire the D-Sub interconnection for computer displays. However, audio jacks have survived multiple generations as other standards have changed. In fact, Intel itself eliminated analog audio jacks in its first-generation NUCs PCs, but had to return them in subsequent generations. With USB-C Digital Audio Intel may not be alone. Google’s Android 5.0 already supports USB DAC devices and thus digital headsets. Moreover, last week LeEco released several smartphones without audio jacks, so, there are attempts to eliminate them from mobile devices already. One maker will not make any difference, but a coordinated move by market leaders, such as Samsung, LG or HTC, could have a significant impact.

Intel Proposes to Use USB Type-C Digital Audio Technology

Intel Proposes to Use USB Type-C Digital Audio Technology

USB Type-C has a number of chances to become the standard for data and charging connector for smartphones and tablets running either Android or Windows. However, in the long-term future, Intel wants USB-C to be even more universal (and therefore pervasive) than it is going to be, which is why at IDF Shenzhen part of one of the talks evolved around using Type-C for audio.

Audio receptacles on PCs and mobile equipment are virtually the last remaining analog interfaces of modern devices, requiring certain techniques to maintain a high audio quality and remove interference. Intel proposes to replace things like 3.5 mm mini-jack with USB Type-C which will help to add features to headsets and will simplify connections of multi-channel audio equipment to various gadgets. This is not the first time a company has proposed to replace analog audio on PCs and mobile devices, but so far, nobody has succeeded due to the ubiquity of 3.5mm. Since the industry may still not be ready to go all-digital, there seems to be a backup plan.

Various types of audio jacks to connect headphones to audio equipment have been around for decades. For example, the original 6.35 mm connector, which is still widely used by audio equipment, was invented in 1878. Meanwhile, two-conductor miniature 3.5 mm audio connector (which is the most widely used audio connector at present) has been around since 1960s. Headphone jacks have evolved; they have gained contacts to support microphones and even basic programmable capabilities to enable remote controls. However, fundamentally, the ability to listen to audio through a speaker has remained the same for over a hundred years: completely analog and barely any smart functionality. Today’s smartphones are used for all sorts of different purposes and are connected to a variety of devices, which requires sophisticated interconnection technologies with high data-rates. At the same time, as phones and devices get thinner, or even to simplify some of the internal design, it gets harder to install multiple ports for various purposes. If there were to be a universal connector that does it all, including audio, Intel and some other players want USB Type-C to be that universal connector.

In fact, USB-C can be used to transfer analog audio in accordance with the specification of the connector. It all comes down as to how that audio is transmitted.

The USB-C has sideband use pins (SBU1 and SBU2) which can be used for analog audio in audio adapter accessory mode. Use of the sideband pins should not impact data transfers and other vital functionality of USB-C cables, which should make them relatively simple from the engineering point of view. In this case, the USB-C connector will just replace the 3.5 mm mini jack and may even gain some additional features, such as a thermal sensor in an earpiece could measure temperature for fitness tracking.

The concept is not completely new and we saw it years ago – back in the 2000s, Motorola used the mini-USB connector on its feature phones to enable charging, data transfers and a headset connection. The idea to use one connector for everything was not entirely bad, however, it left users without a choice of headsets. However, if the makers of devices (as well as producers of audio listening equipment) adopt USB-C, the is potential that the problem will not occur again. In the advent of digital signal transfer, this allows the headset to drive the digital-to-analog conversion, removing electronic interference from the host and potentially offering a wide array of audio results.

However, transferring analog audio using USB-C’s SBU pins is not the only thing that Intel is working on.

At present, Intel is finalizing the USB Type-C Digital Audio technology and plans to release its specification later in Q2. The company does not reveal a lot about the standard right now, but notes that it is working on updating the USB Audio Device Class 2.0 specifications to support new connector, expand the list of recent audio specifications and features, improve power management and simplify the discovery and configuration model to make the upcoming headsets as easy to use as today’s headsets.

In fact, one of the important issues with streaming audio over USB is the synchronization of data streams from the host to the receiver. The USB Audio Device Class specification solved the problem in the past and because Intel mentioned the USB Audio Device Class 2.0 in its presentation at IDF, this may mean that the new the USB-C Digital Audio spec will rely on this synchronization mechanism as well. Intel wants its USB-S Digital Audio to be backward-compatible with USB Audio (1.0 and 2.0), but naturally plans to add support for new music formats.

Usage of digital audio means that headsets should gain their own amplifiers, DACs and various other logic, which is currently located inside smartphones. Intel proposes to install special multi-function processing units (MPUs), which will perform beam forming, noise suppression, acoustic echo suppression (AES), acoustic echo cancellation (AEC), non-linear processing and other operations. The MPUs will also support HDCP technology, hence, it will not be possible to make digital copies of records using USB-C digital headset outputs. It is unlikely that audio processing will be offloaded to external headsets completely, but the latter will clearly gain their own chips. This may, however, see a spike in cost, especially at the super-low end.

A good thing about USB Type-C headsets with MPUs is that they are going to be software upgradeable and could gain functionality over their lifespan. Intel admits that such MPUs will make digital headsets more expensive compared to analog devices, but high volumes and new process technologies will help to reduce the cost of digital headsets over time. In fact, USB Audio headsets and audio chips for them are not something completely new. For example, Plantronics Audio 655 DSP headset costs $49.99, whereas CMedia’s HS-100 chip for headsets is available $1. Therefore, from the cost perspective, digital headphones should not be too much more expensive in general. Meanwhile, Intel wants USB-C digital audio headsets to offer “significant value at higher end” and have improved functionality in a bid to become popular among consumers.

The industry has successfully replaced analog cables with HDMI for video equipment in the living room and in the coming years will retire the D-Sub interconnection for computer displays. However, audio jacks have survived multiple generations as other standards have changed. In fact, Intel itself eliminated analog audio jacks in its first-generation NUCs PCs, but had to return them in subsequent generations. With USB-C Digital Audio Intel may not be alone. Google’s Android 5.0 already supports USB DAC devices and thus digital headsets. Moreover, last week LeEco released several smartphones without audio jacks, so, there are attempts to eliminate them from mobile devices already. One maker will not make any difference, but a coordinated move by market leaders, such as Samsung, LG or HTC, could have a significant impact.

BaseMark Announces The Power Assessment Tool (PAT)

BaseMark Announces The Power Assessment Tool (PAT)

Basemark has traditionally been a software company. We’ve seen and used a lot of their benchmarking test suites including Basemark OS and Basemark X. Seeking to expand its portfolio by not only providing software benchmarks to quantify performance of devices, Basemark looks to provide hardware to enable users to measure power-consumption and power-efficiency of devices. Here is where the PAT (Power Assessment Tool) comes in. The PAT is a tool that doesn’t require destructive dismantlement of a device to be able to measure its power consumption. This is an area where I’m particularly familiar with as over the last year and more have been instrumenting a lot of smartphones via external power supplies and measurement equipment by physically opening them and replacing the lithium power cells. 

Basemark relies on the fact that when smartphones are fully charged, they usually enter a power bypass-mode where the internal battery cell is no longer used, and power is instead drawn directly from the connected charger. To do this the PAT is connected to a conventional charger input. Currently this is a microUSB port but Basemark tells me future revisions might consider going USB C. The output is a USB-A port and thus one can connect any kind of receiving device, be it USB C, microUSB or Lightning port. 

On the software-side the PAT comes with an interface and analysis software that is able to connect to the hardware and show in real-time the power consumption of the device. 

It’s still a bit early to talk about the capabilities of the beta software but Basemark shows promise and once all features are implemented the PAT should represent great value in terms of analysis for both professionals and enthusiastic hobbyists.

The charger input power measurement methodology does come with limitations. For example power consumption exceeding charger power will lead to the device PMIC to compensate by drawing power from the battery – power which then can no longer be tracked. Another problematic scenario is when devices implement charge current limits when the screen is on. While in practice they would be able to charge at rates of up to 12W, they limit themselves to ~5W when the device is used. This limit sometimes falls below the peak power consumption of devices and thus can result in a misleading measurement data. 

While the PAT is officially advertised and validated for power measurement over a device’s USB port, an interesting use-case that I couldn’t help myself testing is trying to use it to directly power and measure the device’s battery power input. With some cable splicing and modifications to be able to just use the + and GND pins of the USB connectors and connect them to the device’s battery input I was able to avoid any of the limitations and draw-backs of measuring power via the device’s input power.

Basemark publishes that the power range on the input and output ports ranges from 4.10V (3.9V output) to 5.25V at up to 1.8A. I’m not sure if these are technical limits or simply the currently validated ranges that Basemark has tested the hardware on as I had no issues connecting fast-chargers with supply voltages of up to 9V. The internal ADC is 16-bit in resolution and able to measure voltage with accuracy of ÷ 140 µV and currents at up to ÷ 1 mA accuracy for the least-significant-bit (LSB). Currently the data sample-rate is configurable down to 1ms resolution but Basemark tells me that the internal ADC is capable of up to ~100kS/s and maybe taken advantage of in future firmware updates.

Overall the PAT is an interesting and useful little tool. Basemark prices the first generation at 995€ without VAT for corporate costumers with limited availability starting in April. At a rather steep starting price, the PAT will need to distinguish itself via its software and analysis capabilities. I’ll be reviewing the PAT more in-depth in the coming months as Basemark continues to refine the software suite, so keep an eye out for more in-depth testing!