CPUs


Intel Plans Merger Of Mobile And PC Divisions

Intel Plans Merger Of Mobile And PC Divisions

According to a report this evening from the Wall Street Journal, in an email sent to employees by Intel CEO Brian Krzanich, Intel has announced plans to merge their struggling Mobile division with the PC Division. The newly created Client Computing Group would be led by Kirk Skaugen, who currently heads the PC division for Intel. The change in reporting is announced to commence in the beginning of calendar year 2015.

The Mobile and Communications Group, which currently is responsible for tablet and smartphone platforms as well as RF transceivers, GPS, Wi-Fi, and Bluetooth will be broken up. The teams which focus on SoC development will join the Client Computing Group, and those which focus on RF technologies will form a new wireless R&D group.

As we reported in Intel’s most recent earnings report, the Mobile and Communications Group had an operating loss of $1.043 billion for Q3 2014. Intel had a goal of putting Atom in to 40 million tablets in 2014, and the plan to do this was to offset the costs of using Bay Trail instead of ARM SoCs, as well as help cover the engineering costs of moving to an Intel platform. While Intel is on track to exceed the original 40 million goal, it has done it at the cost of just over $3 billion to the Mobile and Communications Group bottom line for the nine months ended September 27th.

While this may seem at first glance as a way to move the losses into a profitable division, Intel has not yet decided whether the new divisions will be reflected in their financial reporting structure. So clearly this is not just about the numbers. What this appears to mean is that mobile and desktop will now be given the same priority, and possibly the same access to fabs. In the past, the newest fab nodes have been available for the Core processors first, with the lower margin Atom processors getting access at a later date. The Core processors moved to the Tick-Tock design process where each year a Die shrink (Tick) is alternated with a new microarchitecture (Tock) in 2006, but the Atom processor has just had its first new microarchitecture since 2008 with Silvermont replacing Bonnell. This puts Atom on 22 nm, and a schedule to move to 14 nm in 2015 with Airmont.

On the Core side, the Tick Tock strategy has been almost flawless, with Intel now dominating desktop processor benchmarks and sales. The strategy would likely work well for the mobile sector as well if it had been started several years ago. According to Chuck Malloy, a spokesman for Intel, “The idea is to accelerate the implementation and create some efficiency so that we can move even faster.”

At the same time this may also be a sign that Intel is reevaluating their chip design strategy, and where the line is drawn between Atom and Core. While Silvermont has proven to be no slouch, it is still a mobile focused chip with a narrow pipeline, as opposed to the wider pipeline, higher IPC designs of the Core family. In that sense Core has so far been something of a premium brand for Intel, reserved for higher value (higher margin) devices while Atom has gone into cheaper devices.

If Intel were to shift Core-like high-IPC designs into the Atom family – a distinct possibiltiy now that development for both is under the same roof – that could have a significant impact on Intel’s performance in the mobile market. Apple has already pursued a variant of this strategy to great effect, their Cyclone family of CPUs being very Core-like in design and frequently topping the performance charts in the process. However in the process Apple has thrown some very large (120mm2+) SoCs into their devices, something that helps their performance but would certainly give margin-centric Intel pause for thought.

Overall, although details are light this could signal a big change in the way Intel does business. If mobile gets the same sort of priority as the flagship Core series and the same sort of top-tier architectures, this could be of great benefit to Intel’s CPU performance in the mobile space. At the same time, the PC division may also benefit from some of the mobile experience. As we have seen with Core M, Intel has focused a lot on overall package size and thickness. Moving the expertise in that area into the same division as the people responsible for the Core series could have benefits as well.

With this change just coming into effect at the start of 2015, it will not likely have any impact on Skylake or Airmont, however we could see some synergy in the follow up products.

Source: Wall Street Journal, Bloomberg, PCWorld

Intel Plans Merger Of Mobile And PC Divisions

Intel Plans Merger Of Mobile And PC Divisions

According to a report this evening from the Wall Street Journal, in an email sent to employees by Intel CEO Brian Krzanich, Intel has announced plans to merge their struggling Mobile division with the PC Division. The newly created Client Computing Group would be led by Kirk Skaugen, who currently heads the PC division for Intel. The change in reporting is announced to commence in the beginning of calendar year 2015.

The Mobile and Communications Group, which currently is responsible for tablet and smartphone platforms as well as RF transceivers, GPS, Wi-Fi, and Bluetooth will be broken up. The teams which focus on SoC development will join the Client Computing Group, and those which focus on RF technologies will form a new wireless R&D group.

As we reported in Intel’s most recent earnings report, the Mobile and Communications Group had an operating loss of $1.043 billion for Q3 2014. Intel had a goal of putting Atom in to 40 million tablets in 2014, and the plan to do this was to offset the costs of using Bay Trail instead of ARM SoCs, as well as help cover the engineering costs of moving to an Intel platform. While Intel is on track to exceed the original 40 million goal, it has done it at the cost of just over $3 billion to the Mobile and Communications Group bottom line for the nine months ended September 27th.

While this may seem at first glance as a way to move the losses into a profitable division, Intel has not yet decided whether the new divisions will be reflected in their financial reporting structure. So clearly this is not just about the numbers. What this appears to mean is that mobile and desktop will now be given the same priority, and possibly the same access to fabs. In the past, the newest fab nodes have been available for the Core processors first, with the lower margin Atom processors getting access at a later date. The Core processors moved to the Tick-Tock design process where each year a Die shrink (Tick) is alternated with a new microarchitecture (Tock) in 2006, but the Atom processor has just had its first new microarchitecture since 2008 with Silvermont replacing Bonnell. This puts Atom on 22 nm, and a schedule to move to 14 nm in 2015 with Airmont.

On the Core side, the Tick Tock strategy has been almost flawless, with Intel now dominating desktop processor benchmarks and sales. The strategy would likely work well for the mobile sector as well if it had been started several years ago. According to Chuck Malloy, a spokesman for Intel, “The idea is to accelerate the implementation and create some efficiency so that we can move even faster.”

At the same time this may also be a sign that Intel is reevaluating their chip design strategy, and where the line is drawn between Atom and Core. While Silvermont has proven to be no slouch, it is still a mobile focused chip with a narrow pipeline, as opposed to the wider pipeline, higher IPC designs of the Core family. In that sense Core has so far been something of a premium brand for Intel, reserved for higher value (higher margin) devices while Atom has gone into cheaper devices.

If Intel were to shift Core-like high-IPC designs into the Atom family – a distinct possibiltiy now that development for both is under the same roof – that could have a significant impact on Intel’s performance in the mobile market. Apple has already pursued a variant of this strategy to great effect, their Cyclone family of CPUs being very Core-like in design and frequently topping the performance charts in the process. However in the process Apple has thrown some very large (120mm2+) SoCs into their devices, something that helps their performance but would certainly give margin-centric Intel pause for thought.

Overall, although details are light this could signal a big change in the way Intel does business. If mobile gets the same sort of priority as the flagship Core series and the same sort of top-tier architectures, this could be of great benefit to Intel’s CPU performance in the mobile space. At the same time, the PC division may also benefit from some of the mobile experience. As we have seen with Core M, Intel has focused a lot on overall package size and thickness. Moving the expertise in that area into the same division as the people responsible for the Core series could have benefits as well.

With this change just coming into effect at the start of 2015, it will not likely have any impact on Skylake or Airmont, however we could see some synergy in the follow up products.

Source: Wall Street Journal, Bloomberg, PCWorld

Intel Haswell-EP Xeon 12 Core Review: E5-2650L V3 and E5-2690 V3

As part of our Haswell-EP coverage, the next two processors on our test beds are both 12 core variants. The E5-2650L V3 is a surprising monster, giving 12 Haswell cores at 1.8 GHz with 2.5 GHz turbo for only 65W, while the E5-2690 V3 extends the power…

Intel Haswell-EP Xeon 12 Core Review: E5-2650L V3 and E5-2690 V3

As part of our Haswell-EP coverage, the next two processors on our test beds are both 12 core variants. The E5-2650L V3 is a surprising monster, giving 12 Haswell cores at 1.8 GHz with 2.5 GHz turbo for only 65W, while the E5-2690 V3 extends the power…

More Intel Core M Coming Q4

More Intel Core M Coming Q4

Since Computex, there has been a lot of talk around Intel’s Broadwell-Y / Core-M CPU line. In August Intel treated us to a breakdown of the 14nm process and the Broadwell architecture including all the improvements therein, followed by a more succinct breakdown of the CPUs we should expect. These initial CPUs should be properly available to the public in Q4 in devices such as the Lenovo Yoga 3 Pro using the Core M-5Y70.

The news this week revolves around more Core M CPUs being pushed through the system. This is most likely as a result of Intel binning the CPUs in sufficient quantities to satisfy customers. The specifications are available at ark.intel.com, but the Core M line now stands at seven different SKUs:

Intel Core M Specifications
  5Y71
(New)
5Y70 5Y51
(New)
​5Y31
(New)
5Y10c
(New)
5Y10a 5Y10
Cores / Threads 2 / 4 2 / 4 2 / 4 2 / 4 2 / 4 2 / 4 2 / 4
Base Frequency / MHz 1200 1100 1100 900 800 800 800
Turbo Frequency / MHz 2900 2600 2600 2400 2000 2000 2000
Processor Graphics HD 5300 HD 5300 HD 5300 HD 5300 HD
5300
HD
5300
HD 5300
IGP Base Frequency / MHz 300 100 300 300 300 100 100
IGP Turbo Frequency / MHz 900 850 900 850 800 800 800
L3 Cache 4 MB 4 MB 4 MB 4 MB 4 MB 4 MB 4 MB
TDP 4.5 W 4.5 W 4.5 W 4.5 W 4.5 W 4.5 W 4.5 W
LPDDR3/DDR3L 
Support
1600 MHz 1600 MHz 1600 MHz 1600 MHz 1600 MHz 1600 MHz 1600 MHz
Intel vPro Yes Yes No No No No No
Intel TXT Yes Yes No No No No No
Intel VT-d/VT-x Yes Yes Yes Yes Yes Yes Yes
Intel AES-NI Yes Yes Yes Yes Yes Yes Yes

The new high end model is the 5Y71, offering a 2.9 GHz frequency mode and vPro features. The 5Y51 has slightly better specifications than the higher numbered 5Y70, but loses vPro compatibility. Both the 5Y31 and 5Y51  fill in the large gap between the 5Y10a and 5Y70 in the initial launch. All four new processors all have an improved base GPU frequency, up to 300 MHz, and are slated to work at a cTDP Up of 6W or cTDP Down of 3.5W, depending on the customer’s needs.

All new CPUs are slated for a Q4 launch, which would mean that they might become available for end users in products on the shelf sometime in Q1 2015.

Source: CPU-World