CPUs


AMD Ryzen Threadripper 1950X and 1920X: We’re Allowed To Show Pictures Now

AMD Ryzen Threadripper 1950X and 1920X: We’re Allowed To Show Pictures Now

One of the interesting things to come out of this Threadripper launch is the stack of embargos. Last week AMD revealed the launch date and pricing, which will incidentally also be the date for our review of both chips. AMD also inserted a small embargo in the middle for today, allowing media outlets to do unboxings.

We’re Allowed To Show Pictures Now

Rather than discuss each element of what AMD shipped the ~250 reviewers who have review kits, this article is going to be mainly a picture story with annotations. Starting with a pelican case that AMD shipped the CPUs in.


Mug for Scale

Inside the massive padded box were two CPUs in special cases, along with a paperweight.

Yes, that’s an actual CPU in the paperweight, printed with AnandTech’s logo. We got CPU 30 out of 250.

Who has #1 ?

Each of the CPUs was in this overly padded secondary box.

 
Vital Codes

The instructions were far from clear. I tried to record this on video. Some swearing was involved – you definitely need two hands for this.

The CPU is housed in its own secondary support system. Twist, unlock, pull, grip, fail, try again, use force, swear, then eventually get the latch off.

The CPU comes in this orange holder. The orange holder goes into the motherboard as well, so there’s no need to take the CPU out.

The box also contains a bracket for Asetek liquid coolers to fit, and a Torx Screwdriver. There are some stickers as well.

Putting it in the socket is fairly easy – three Torx screws and the mechanism pops open. Slide into the tray, close the screws. I had more issues with the CPU cooler mechanism than the CPU tray.

This last picture shows how thermal paste spreads across the CPU after a couple of days of testing with a tight liquid cooler. We can’t say much about temperatures at this point because of the embargo.

Paperweight. No idea if the CPU inside actually works.

Along with the CPUs, AMD supplied almost everything needed for the system: an ASUS X399 Zenith Extreme motherboard, 32GB of G.Skill Trident RGB DDR4-3200 C14 memory, a 512GB Samsung 960 Pro M.2 drive, a Thermaltake Toughpower Grand 1200W, and a Thermaltake Floe Riing 360 Premium liquid cooler (a 3×120 side radiator). The only thing missing was a Vega GPU (ed: you don’t get everything).

What Does This Mean

I’ve never had a review sample come with quite so much kit in such extravagant packaging. Back with Ryzen they supplied a hardwood box with all the kit, and this one goes another stage up. AMD knows they can cause a stir on the social channels by being big and bright rather than staying understated, and to a certain extent, it works (as long as the company can afford it). It’s a corner of the product release cycle that AMD has honed in on, or one that its competitors have missed, although it is hard to gauge the return on investment and requires a marketing head to approve it nonetheless.

AMD Ryzen SKUs
  Cores/
Threads
Base/
Turbo
XFR L3 DRAM
1DPC
PCIe TDP Cost Cooler
TR 1950X 16/32 3.4/4.0 ? 32 MB 4×2666 60 180W $999
TR 1920X 12/24 3.5/4.0 ? 32 MB 4×2666 60 180W $799
TR 1900X 8/16 3.8/4.0 +200 ? 4-Ch 60 ? $549
Ryzen 7 1800X 8/16 3.6/4.0 +100 16 MB 2×2666 16 95 W $499
Ryzen 7 1700X 8/16 3.4/3.8 +100 16 MB 2×2666 16 95 W $399
Ryzen 7 1700 8/16 3.0/3.7 +50 16 MB 2×2666 16 65 W $329 Spire
Ryzen 5 1600X 6/12 3.6/4.0 +100 16 MB 2×2666 16 95 W $249
Ryzen 5 1600 6/12 3.2/3.6 +100 16 MB 2×2666 16 65 W $219 Spire
Ryzen 5 1500X 4/8 3.5/3.7 +200 16 MB 2×2666 16 65 W $189 Spire
Ryzen 5 1400 4/8 3.2/3.4 +50 8 MB 2×2666 16 65 W $169 Stealth
Ryzen 3 1300X 4/4 3.5/3.7 +200 8 MB 2×2666 16 65 W $129 Stealth
Ryzen 3 1200 4/4 3.1/3.4 +50 8 MB 2×2666 16 65 W $109 Stealth

What now? Time to get back to testing. Review next week. 

The Change in NDA Philosophy: A Personal Commentary

This new ‘unboxing’ sort of embargo has been borne from a rapid change in how media approaches launches and NDAs.

In the past, from 2014 and before, when there was a product NDA in place it was expected that no media would even acknowledge that they had the product, let alone disclose the date of launch. In the advent of a more social media focused – and younger – technology press, skirting those NDA lines with product images has now become almost a standard: if you have the product, flaunt it, and generate hype for the review/video. Even when there is an NDA in place specifically barring certain types of content, such as unboxings, it seems that posting screenshots or gifs of the upcoming unboxing content being edited before the NDA is becoming the norm.

The reasoning stems from the fact that NDAs typically restrict product reviews and only mention performance and data analysis to be revealed at a certain date, and the argument is that the NDAs often say nothing about showcasing the product before the launch (or even if the NDA is itself under NDA). Depending on the company, this has had a mixed response: typically an incumbent market leader will come down hard if NDA rules are pushed, although PR teams and underdogs like to push the hype train as many times around the track as possible if the product is good.

AnandTech in this respect is fairly old-school: we’d rather spend more time testing the product to give more data for our analysis and reviews, making sure our readers have the sufficient knowledge at hand to invest in a product. Unboxings on AT are few and far between because there usually isn’t that much to show for our typical user base that know technology – it only really makes sense to us when something is unusual (like Threadripper), or to show to new users that may become enthusiasts. Ultimately, it’s that latter group that has spurned the tech media to invest in social media for this sort of content, especially around high-performance components or hardware where it actually makes sense, like monitors. Unboxing products like a CPU would usually take several seconds: CPU, manual, cooler, sticker, done.

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Coffee Lake Not Supported by Intel’s 200-Series Motherboards

Coffee Lake Not Supported by Intel’s 200-Series Motherboards

In a stunning bit of Twitter, a tweet from one of the leading motherboard manufacturers has stated that Coffee Lake, Intel’s 8th Generation Core processors, will not be supported on the current generation of 200-series motherboards.

No,Coffee Lake CPU is not compatibilble with 200 series motherboards.

— July 31, 2017

Information like this is usually kept under wraps until an Intel reveal, but it seems to have been mindlessly posted to Twitter on July 31st, an account that last tweeted on April 11th before this tweet occurred. This tweet has since been deleted.

At this point, due to the similar microarchitecture to Kaby Lake being used in Coffee Lake, most of the technology press were under the impression that the Coffee Lake processors would be compatible with LGA1151 socket motherboards, namely the 100-series and 200-series. With the above tweet essentially confirming that Coffee Lake will not be supported, it means that either the new CPUs will not be LGA1151, or that the motherboards will lock-out the processors by firmware, or the CPUs and sockets will use a different notching system to ensure the wrong processor cannot be put in the wrong board. It does mean however that 200-series users hoping to upgrade to a Coffee Lake processor (which early reports are suggesting might be up to six cores, but this has not been announced) will not be able to.

There are many potential reasons for the change if the socket is still LGA1151. The obvious one would be product segmentation on Intel’s part, which would stick in the craw for a number of the user base. The second one that it might actually be a physical requirement for the processor – if previously unused pins are required for power and/or control for different elements of the DVFS in the chip. This would depend on new features on the chip, which could extend to different power management, different graphics, or different IP blocks that require separate pin-out connections. Intel might also be using a different power system for voltage regulators, which might not be compatible with current 200-series motherboards.

At this point, nothing has been made official. The fact that this was stated on Twitter so far from any launch date that we know of is an interesting development.

*The name of the manufacturer has been removed by request after this news was published.

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Intel Announces Q2 FY 2017 Earnings: Record Quarter

Intel Announces Q2 FY 2017 Earnings: Record Quarter

This afternoon, Intel announced their second quarter results for fiscal year 2017, and continuing a trend, they have once again set a record for the current quarter. Intel recorded $14.8 billion in revenue this quarter, up 9% from a year ago. Operating income, which was down dramatically a year ago due to restructuring charges, has rebounded to $3.8 billion for the quarter, up 190% when compared to a year ago when they took the restructuring hit. Gross margin came in at 61.6%. Net income was up 111% to $2.8 billion, and earnings per share were up 115% to $0.58 per share.

Intel Q2 2017 Financial Results (GAAP)
  Q2’2017 Q1’2017 Q2’2016
Revenue $14.8B $14.8B $13.5B
Operating Income $3.8B $3.6B $1.3B
Net Income $2.8B $3.0B $1.3B
Gross Margin 61.6% 61.8% 58.9%
Client Computing Group Revenue $8.213B +3.0% +11.9%
Data Center Group Revenue $4.372B +3.3% +8.6%
Internet of Things Revenue $720M flat +25.9%
Non-Volatile Memory Solutions Group $874M +1.0% +57.8%
Programmable Solutions Group $440M +3.5% -5.4%
All Other Revenue $144M -75% -75%

Intel also released Non-GAAP results to account for the restructuring charges, and they give a better look at the underlying business without the wild swings taken into account when there is a large hit to the bottom line. On a Non-GAAP basis, revenue was the same, at $14.8 billion, up 9%, and gross margins were 63%. Not factoring in certain charges such as acquisition costs and restructuring, operating income came in at $4.2 billion, up 30% from a year ago. Net income was up 23% to $3.5 billion, and earnings per share were up 22% to $0.72 per share.

Intel’s Client Computing Group, which includes platforms for notebooks, 2-in-1 systems, desktops, tablets, phones, wireless, and mobile communications, had a very strong quarter, with revenue up 12% from a year ago to $8.2 billion. Notebook revenue was up 20% from a year ago, while desktop processor revenue slid 3%. Overall, Intel sold 3% more units in Q2 2017 compared to Q2 2016, and average selling prices increased 8%. We’ve not seen anything yet post 14nm, but Kaby Lake’s improved 14nm process is still very competitive, and was able to boost overall performance without any changes in IPC by allowing higher frequencies in the same thermal design. AMD’s new Ryzen platform doesn’t yet compete with Intel in the notebook space, so this will be interesting to watch, since AMD really has no competition to Core based SoCs at this time. Intel announced on their earnings call that they expect to begin shipping 10nm chips in low volume by the end of 2017, with a ramp up to higher volumes in 2018, so 14nm is still going to be the prevalent process for some time. It could easily be CES before we start to see shipping systems with 10nm, although Intel is currently sampling customers with engineering samples right now.

The Data Center Group continues to perform very well, and Intel sees this business having a lot of growth in the future. Revenue for this group was up 9% year-over-year to $4.4 billion. Operating income was $1.66 billion for this group, down 6% from a year ago. The lower margin was attributed to the move to 14nm, which has higher startup costs, and development costs, along with investments in AI. Intel shipped 7% more units, and average selling price was up 1%. We’ve just seen Intel announce the Xeon Scalable Processor Family, and they have had a pretty impressive response to this new branding. Intel shipped over 500,000 units to over 30 customers, which makes it the largest early ship program they’ve ever had. Intel faces strong competition here from AMD though, so we’ll see how the reshuffle their product stack over the next while.

Intel’s Internet of Things revenue was up 26% year-over-year to $720 million in revenue. This segment has had some product changes over the last quarter, with Intel discontinuing their Galileo, Joule, and Edison lines, but Intel is still moving forward in this space with other products for industrial, video, and automotive. Despite the shakeup, this group increased its operating income 56% to $139 million.

The Non-Volatile Memory Solutions Group had strong revenue growth as well, jumping 57.8% from a year ago to $874 million. Intel is now shipping 64-layer 3D NAND solutions, and they feel they have a competitive advantage there with density. Operating income for this group was still a loss of $110 million, compared to a $224 million loss a year ago, but Intel says that the core NAND business was profitable this quarter, and they expect it to be profitable the rest of the year. Intel Optane has shipped over 200l,000 units so far, and the profitability includes the ramp up of more 3D XPoint memory.

Programable Solutions Group, which includes Intel’s Altera FPGA business, had a drop in revenue from $465 million a year ago to $440 million this year. Operating income was almost flat at $97 million. They had growth in industrial, military, and embedded FPGAs, but that growth was more than offset by lower data center revenue for this quarter.

Intel is forecasting revenue of $15.7 billion, plus or minus $500 million for Q3, with gross margins around 61%.

Intel is on track to deliver yet another record year, with the first two quarters both setting new records for revenue, on the heels of their record setting 2016 fiscal year. They’ve got some strong competition though to compete against, and it should be fascinating to see how the next couple of quarters play out.

Source: Intel Investor Relations