Intel Confirms 8th Gen Core on 14nm, Data Center First to New Nodes

A quick news piece on information coming out of Intel’s annual Investor Day in California. As confirmed to Ashraf Eassa by Intel at the event, Intel’s 8^th Generation Core microarchitecture will remain on the 14nm node. This is an interesting development with the recent launch of Intel’s 7^th Generation Core products being touted as the ‘optimization’ behind the new ‘Process-Architecture-Optimization’ three-stage cadence that had replaced the old ‘tick-tock’ cadence. With Intel stringing out 14nm (or at least, an improved variant of 14nm as we’ve seen on 7^th Gen) for another generation, it makes us wonder where exactly Intel can promise future performance or efficiency gains on the design unless they start implementing microarchitecture changes.

Despite this, if you were to believe supposed ‘leaked’ roadmaps (which we haven’t confirmed from a second source as of yet), the 8^th Generation product ‘Cannon Lake’ is more geared towards the Y and U part of Intel’s roadmap. This would ring true with a mobile first strategy that Intel has mirrored with recent generations such that the smaller, low power chips are off the production line for a new product first, however we’d also expect 10nm to also be in the smaller chips first too (as demonstrated at CES). Where Cannon Lake will end up in the desktop or enterprise segment however remains to be seen. To put something a bit more solid into this, Ashraf also mentioned words from Dr. Venkata ‘Murthy’ Renduchintala, VP and GM of Client and IoT:

‘Murthy referred to it at the event, process tech use will be ‘fluid’ based on segment’.

If one read too much into this, we may start seeing a blend of process nodes for different segments at the same time for different areas of the market. We already do have that to some extent with the mainstream CPUs and the HEDT/Xeon families, but this phrasing seems that we might get another split between consumer products or consumer and enterprise. We may get to a point where Intel’s ‘Gen’ naming scheme for its CPUs covers two or more process node variants.

Speaking of the Enterprise segment, another bit of information has also surfaced, coming from a slide during a talk by Diane Bryant (EVP/GM of Data Center) and posted online by Ashraf. The slide contains the words ‘Data center first for next process node’

We can either talk about process node in terms of the ‘number’, either 14nm/10nm/7nm, or by variants within that process (high power, high efficiency). One might suspect that this means Intel is moving hard and fast with 10nm for Xeons and big computing projects, despite showing off 10nm silicon at CES earlier this year. That being said, it’s important to remember that the data center market is large, and includes high-density systems with many cores, such as Atom cores, and Intel did recently open up its 10nm foundry business to ARM Artisan IP projects. So while the slide does say ‘Data center first’, it might be referring to DC projects based on ARM IP in that segment rather than big 4-24+ core Xeons. At this stage of the game it is hard to tell.

On top of all this, Intel still has extreme confidence in its foundry business. An image posted by Dick James of Siliconics from the livestream shows Intel expects to have a three-year process node advantage when its competitors (Samsung, TSMC) start launching 10nm:

I’ve been brief with this news for a reason – at this point there are a lot of balls in the air with many different ways to take this information, and the Investor Day is winding down on talks and finishing with smaller 1-on-1 meetings. We may get further clarification on this news as the day goes on.

Update 1: On speaking with Diane Bryant, the ‘data center gets new nodes first’ is going to be achieved by using multiple small dies on a single package. But rather than use a multi-chip package as in previous multi-core products, Intel will be using EMIB as demonstrated at ISSCC: an MCP/2.5D interposer-like design with an Embedded Multi-Die Interconnect Bridge (EMIB).

An Intel Slide from ISSCC, via PC Watch

Initially EMIB was thought of as a technology relating to Intel’s acquisition of Altera and potential future embedded FPGA designs, and given the slide above and comments made at the Investor Day, it seems there are other plans for this technology too. The benefit of using multiple smaller dies over a large monolithic 600mm2 die is typically related to cost and yield, however the EMIB technology also has to be up to par and there may be a latency or compatibility trade-off.

Intel to Equip Fab 42 for 7 nm

Intel this week announced plans to bring its Fab 42 online to produce semiconductors using a 7 nm fabrication process. It will take three to four years, and the move will cost Intel several billions of dollars but will create approximately 3,000 of high-tech jobs in Chandler, Arizona. Unfortunately, Intel did not share details about its 7 nm manufacturing technology at this time.

Intel began construction of its Fab 42 back in 2011 with the aim to build the most advanced, high-volume chip production facility in the world. The building was completed in 2013, but instead of moving in equipment to produce chips using 14 nm fabrication process, Intel decided to postpone its completion in early 2014. The site is equipped with heating, air conditioning, and other essential things, but no actual semiconductor manufacturing equipment has been installed. Intel still has no immediate public plans to use the Fab 42 for the production of chips using its 10 nm process technology in the short-term future but has indicated it intends to use it for its 7 nm ICs several years down the road.

Intel intends to spend as much as $7 billion to equip Fab 42, but at the moment the company does not share what kind of tools it plans to install. As a result we have no new information about Intel’s 7 nm technology. Intel has implied that it could start using extreme ultraviolet (EUV) lithography at 7 nm, but has never committed to the plan. Earlier this year the company said it would invest in a 7 nm pilot line in one of its development sites, but did not elaborate beyond that. One of the things that the CEO of Intel disclosed about the 7 nm in general in his email to employees this week is that it requires “an increasing amount of factory space per wafer.” This possibly means that Intel will insert EUV equipment into the process technology for cirical layers and will continue to use a lot of multipatterning, which increases the diversity requirements for the production tools.

Intel believes that when completed, Fab 42 will be the most advanced semiconductor wafer fab in the world that will create 3,000 direct high-tech jobs and 10,000 direct and indirect jobs in total. It should be noted that the semiconductor company will not start to move in equipment into the Fab 42 before it figures out all the peculiarities of the 7 nm manufacturing technology. Once it finalizes the pilot line and is satisfied with the equipment performance, it starts to replicate the line at different sites.

Intel said that it will use its 7 nm fabrication process to produce various processors for PCs, data centers and other devices that will be used for AI, automated driving, medical research/treatment as well as other applications. So, as usually, the manufacturing technology will be positioned to make the whole stack of Intel’s products several years from now.

Related Reading:

• Intel Announces Record Quarterly Revenue And Full-Year Revenue For Q4’2016
• Intel Compute Card: A Universal Compute Form-Factor for Different Kinds of Devices
• CES 2017: Intel Press Event Live Blog

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