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Compulab Passively-Cooled Airtop2 Inferno with GeForce GTX 1080

Compulab Passively-Cooled Airtop2 Inferno with GeForce GTX 1080

Compulab has announced its first passively-cooled gaming desktop computer developed using the company’s expertise in fanless SFF systems. The Airtop2 Inferno uses an enhanced version of the Compulab’s proprietary natural air-flow (NAF) cooling system that can handle Intel’s Core i7-7700K processor as well as NVIDIA’s GeForce GTX 1080 graphics card. The Airtop2 Inferno will only be mass-produced if the company sees interest from the end user towards such systems.

Miniature gaming computers are certainly a part of an ongoing trend towards miniaturization of PCs in general — numerous manufacturers offer SFF gaming systems. Passively-cooled gaming PCs represent another category. Numerous companies have attempted to build such systems and/or produce appropriate components (e.g., Calyos, Zalman, etc.), but they were either very expensive, large, or had compromises when it comes to performance. Enter, Compulab. The company has been producing fanless special-purpose SFF PCs since 2007 and has experience with passive cooling. Compulab has been selling its specialized Airtop-branded fanless workstations for over two years now and this month it announces plans to expand its business to gaming systems. The first of such machines will be the Airtop2 Inferno that builds upon the workstation introduced earlier this month, but has an improved cooling system that can handle higher TDPs.

The Compulab Airtop2 Inferno relies on a specially-designed Intel C236-based motherboard and will be equipped with Intel’s Core i7-7700K processor as well as NVIDIA’s GeForce GTX 1080 graphics card. The system can be outfitted with up to 64 GB of DDR4-2400 memory, two M.2 NVMe SSDs and four 2.5”/9.5mm SATA storage devices. When it comes to I/O capabilities, the Airtop Inferno2 will have two USB 3.1 Gen 2 (USB-A and USB-C) ports (enabled by a FACE module), seven USB 3.0 headers, two GbE controllers, optional 802.11ac Wi-Fi, Bluetooth, audio connectors, DisplayPort 1.2 as well as HDMI outputs and so on. Since the Airtop2 Inferno relies on the Airtop2, it has almost the same connectivity capabilities as the fanless workstation, so it supports an optional 4G/LTE modem as well as FACE expansion modules.

The key difference between the Airtop2 and the Airtop2 Inferno is the enhanced natural air-flow (NAF) cooling technology capable of removing up to 300 W of heat. As discussed two years ago, the NAF heat-exchange system uses two special side-panels, each of which can dissipate heat. The side-panels are equipped with traditional flat copper heat-pipe arrays (with micro-channels) that take away heat from the hottest components (i.e., the CPU and the GPU) and spread it across the side-panel. The heat from the heat-pipe arrays is removed by the special air-tube panels consisting of 14 tubes with air inside. Once the air gets hot, it starts to rise up, removing heat from the side panels. The Airtop2 Inferno has side panels that feature additional aluminum tubes/heat spreaders that can dissipate more heat than the regular NAF panels and therefore handle TDP of Intel’s Core i7-7700K as well as NVIDIA’s GeForce GTX 1080. Compulab believes that the maximum TDP rating that the NAF Inferno cooling system can handle is 300 W, enough to keep the aforementioned CPU and GPU cool, but without overclocking.

Compulab Airtop2 Inferno
  General Specifications
CPU Intel Core i7-7700K (4C/8T, 4.2/4.5 GHz)
Chipset Intel C236
SKL, KBL support,
up to 20 PCIe 3.0 PCIe lanes
x1, x2, x4 bifurcation
RAID, vPro, TXT etc.
RAM Up to 64 GB DDR4-2400
GPU NVIDIA GeForce GTX 1080 8 GB
Intel HD Graphics 630
Storage DFF 4 × 2.5″/9.5mm SATA HDDs/SSDs or
2 × 2.5″/15mm SATA drives
Modules 2 × M.2-2280 PCIe NVMe SSDs
3 × M.2-22110 PCIe NVMe SSDs on backplane card installed instead of discrete graphics card
Expansion PCIe x16
FACE Modules
Display Outputs iGPU 2 × DisplayPort 1.4
1 × HDMI 1.4
dGPU 3 × DisplayPort 1.4 + 1 × HDMI 2.0b
Networking Wired Dual GbE: Intel I219 + Intel I210
Wireless 802.11ac, 2T2R, 2.4 GHz/5GHz
Bluetooth 4.2
WWAN Optional M.2 B-key 3042 + 2×RP-SMA antennas modem with micro-SIM
I/O Front: 2 × USB 3.1 Gen 2 (USB-A, USB-C), 1 × USB 3.0
Back: 6 × USB 3.0, 3 × RS232
Audio Realtek ALC1150 audio codec with line-out, mic, S/PDIF
Dimensions 150 × 300 × 255 mm
5.9″ × 11.8″ × 10″
Volume ?
Operating System Windows 10
FACE Modules FM-AT2 Built-in-self-test LED indicators | 2x USB 3.0 | audio | micro-SD | mini-PCIe
FM-POE 4x Gbit Ethernet with PoE (PSE) | 2x USB 2.0
FM-LANE4U4 4x Gbit Ethernet | 4x USB 2.0
FM-OPLN 2x Optical Gbit Ethernet (SFP+) | 2x USB 2.0
FM-EBP Gigabit Ethernet bypass
FM-SER 6x RS232 / RS485
FM-XTDM2 2x mini-PCIe

Compulab describes its Inferno as the Airtop2 on steroids. It is very similar, but uses a different processor, graphics card, cooling system, PSU and is equipped with a module that enables USB 3.1 Gen 2 connectivity. The company has finished development of the system, but needs to fabricate the extra passive cooling elements, for which it plans to run a special crowdfunding campaign. With all things go, Compulab intends to ship the system in June. The actual price of the Airtop2 Inferno will depend on exact configurations of RAM and storage, but expect starting price to be comparable with pricing of beefed-up Airtop2 workstation.

Compulab expects to start selling the Airtop2 Inferno direct from its website in a couple of months.

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HP’s Snapdragon 835-Based Envy X2 2-in-1 Available for Pre-Order, Starts at $999

HP’s Snapdragon 835-Based Envy X2 2-in-1 Available for Pre-Order, Starts at $999

HP has started to take pre-orders on its new Envy X2 2-in-1 notebook based on Qualcomm’s Snapdragon 835 SoC and Windows 10 S. The 12.3” device is designed as a thin always connected unit, and rated for up to 22 hours on one charge. The price of the new Envy X2 is higher than we imagined when these devices were first announced: it starts at $999.

The 2018 HP Envy X2 2-in-1 detachable laptop comes with a 12.3” WUXGA+ touch-enabled display covered with Corning Gorilla Glass. The system runs the Qualcomm Snapdragon 835 SoC equipped with 4 GB of LPDDR4-3733 DRAM and 128 GB of eUFS storage (models with enhanced DRAM and storage are expected to be available later). The PC’s physical interfaces include one physical USB 3.1 Type-C header (with DisplayPort and USB Power Delivery support), a microSD card reader, and a 3.5-mm TRRS audio input. Wireless connectivity capabilities comprise of a 2×2 802.11ac Wi-Fi module with Bluetooth 5, and the built in Gigabit LTE modem from the SoC. The built-in SoC modem is meant to be one of the key features of the Envy X2 – it makes the device always connected in all areas with 3G and/or 4G networks, which essentially means everywhere in well-developed countries. For imaging, the device uses a 13 MP rear camera and a 5 MP front-facing camera.

The new Envy X2 is equipped with a 49.33 Wh battery that is rated to enable up to 19 hours of continuous video playback (at 150 nits brightness) or up to 22 hours of mixed-use workloads (HP does not tell how it tested these).

When it comes to portability, the HP Envy X2 is in line with professional tablets and advanced thin-and-light notebooks. The tablet itself it is 6.85 mm (0.27”) thick and weighs 698.5 grams (1.54 lbs), which is comparable to Apple iPad Pro 12.9”. When outfitted with a keyboard, the weight of the new Envy X2 bumps to 1.211 kilograms (2.67 lbs), which is similar to fully-fledged 13”-class laptops.

HP lists the S835 as running at 2.2 GHz base and 2.6 GHz turbo, which is typically how we describe an x86 PC, not a smartphone SoC: the S835 has two sets of cores, normally listed as 1.90 GHz on the efficiency cores and 2.45 GHz on the performance cores, neither of which correlates to HPs listing. So either this is a faster Snapdragon S835 bin, or there is miscommunication in the specification sheet. In this form factor there is a better opportunity for more cooling, which would be suitable for a higher frequency bin of SoC. But nonetheless, the 2.2-2.6 GHz listed on HP’s website is not telling the whole story.

Specifications of the HP Envy X2 (2018)
  Model 12-e011nr
Display 12.3″
1920×1280
187 PPI
CPU Qualcomm Snapdragon 835
4 x Kryo 280 Performance (2.2 GHz – 2.6 GHz)
4 x Kryo Efficiency (? GHz)
Graphics Adreno 540 GPU at 710 MHz
RAM 4 GB
Storage 128 GB eUFS
Wi-Fi Qualcomm WCN3990
2×2 802.11ac Wi-Fi
Bluetooth Bluetooth 5
WWAN Qualcomm X16 Gigabit LTE
USB 3.0 1 × Type-C
Cameras Front 5 MP
Rear 13 MP
Other I/O Microphone, stereo speakers, audio jack, trackpad, MicroSD card reader, etc.
Battery 49.33 Wh
Battery Life 19-22 hours
Dimensions Width 292.8 mm | 11.53″
Height 210.3 mm | 8.28″
Thickness 6.85 mm | 0.27” (tablet only)
Weight Tablet 698.5 grams | 1.54 lbs
Tablet+KB 1.211 kilograms | 2.67 lbs

Like all Envy-branded devices, the new Envy X2 is designed to offer a premium experience: it comes in a brushed aluminum enclosure, features an audio sub-system co-developed with Bang & Olufsen, has a full-size magnetically attached keyboard/cover, and a stylus supporting Windows Ink technology (it is plausible to assume that the pen supports at least 1024 levels of sensitivity, but HP has not formally confirmed that). This premium look and feel comes at a price.

The Envy X2 model with 4 GB of RAM and 128 GB of NAND flash storage costs $999.99 and will ship on March 9. By contrast, the ASUS NovaGo TP370 with 8 GB of RAM and 128 GB of storage is priced at $799, whereas Lenovo’s Miix 630 is also expected to start from $799. Apple’s iPad Pro 12.9” with 4 GB of RAM, 64 GB of storage, a 4G/LTE modem and a keyboard is priced at $1197 (a version with 256 GB of NAND, a keyboard and stylus costs $1347), evidently HP aims its new Envy X2 at the same segment.

The latest HP Envy X2 is a product of Microsoft’s new attempt to marry nearly full-sized Windows and ARM. For HP, this is the first device running an ARM SoC and Windows for PCs. Several years ago, HP did not support Microsoft’s Windows RT (the software giant’s previous failed shot for ARM) and decided to focus on Atom- and then Core M-based Envy X2 running Windows 8/8.1/10 instead (many of such systems cost less than $1000). This time HP decided to go with S835 in a bid to offer a sleek always-connected Windows 10 device with an extra-long battery life. Since it is an Envy, it is priced accordingly and it remains to be seen whether end users are willing to spend this amount of money on this device. Obviously, the new Envy X2 is always connected and can work for a long time on one charge, but in Windows 10 S environment it can only run either specially-optimized applications, or perform binary translation (or another form of emulation) for 32-bit x86 applications (64-bit x86 apps are not supported) which naturally results in reduced performance.

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