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Plextor Launches M8V SATA SSD

Plextor Launches M8V SATA SSD

Plextor has introduced the M8V series, their latest budget SATA SSDs, now with 64-layer 3D TLC NAND. Plextor’s budget SATA drives tends to use whatever controller and NAND combination makes the most sense at the time—they aren’t limited to reference designs from the controller vendors, and instead Plextor and parent company Lite-On design their own drives and controller firmware. For this iteration, Plextor has chosen the Silicon Motion SM2258 controller and Toshiba’s 64L 3D TLC NAND flash. Last time around with the M7V it was Toshiba 15nm planar TLC and a Marvell controller, and the preceding M6V used Toshiba 15nm MLC with the Silicon Motion SM2246EN controller. Silicon Motion’s controllers have mostly been used with Intel/Micron 3D NAND recently, so the M8V will provide an interesting opportunity for comparison between two competing 3D NAND designs paired with the same controller.

Plextor M8V Specifications
Capacity 128 GB 256 GB 512 GB
Form Factor 2.5″ SATA and M.2 2280 SATA
Controller Silicon Motion SM2258
NAND Toshiba 64-layer 3D TLC
Sequential Read up to 560 MB/s up to 560 MB/s up to 560 MB/s
Sequential Write up to 400 MB/s up to 510 MB/s up to 520 MB/s
4KB Random Read  up to 60k IOPS up to 81k IOPS up to 82k IOPS
4KB Random Write  up to 70k IOPS up to 80k IOPS up to 81k IOPS
Endurance 70 TBW 140 TBW 280 TBW
Warranty 3 years

In this product segment, Plextor is still sticking with capacities ranging from 128GB to 512GB and three year warranties. Write endurance is rated at a reasonable 0.5 drive writes per day, giving the M8V a total write endurance rating on par with most consumer SSDs that have five year warranties but are rated for only 0.3 DWPD. The M8V is available as a 2.5″ drive with the model number M8VC, or as a M.2 SATA drive with model number M8VG.

Our 512GB sample just arrived and will take its turn on our SSD testbed soon.

Microsoft Announces Q2 FY 2018 Earnings

Microsoft Announces Q2 FY 2018 Earnings

This afternoon, Microsoft announced their earnings for the second quarter of their 2018 fiscal year. The company had revenues of $28.9 billion for the quarter, which is up 12% from a year ago, and was driven by strong growth in their business offerings and cloud revenue. Gross margin for the quarter was 62%, which is flat compared to Q2 2017. Operating income was $8.7 billion for the quarter, which was up 10% year-over-year, but Microsoft is taking a $13.8 billion charge on deemed repatriation of deferred foreign income, so for this quarter, in terms of GAAP results, they are reporting a net loss of $6.3 billion, which results in a loss per share of $0.82. Excluding that charge, net income would have been up 20% to $7.5 billion.

Microsoft Q2 2018 Financial Results (GAAP)
  Q2’2018 Q1’2018 Q2’2017
Revenue (in Billions USD) $28.918 $24.538 $25.826
Operating Income (in Billions USD) $8.679 $7.708 $7.905
Gross Margin (in Billions USD) $17.854 $16.260 $15.925
Margins 61.7% 66.3% 61.7%
Net Income (in Billions USD) -$6.302 $6.576 $6.267
Basic Earnings per Share (in USD) -$0.82 $0.85 $0.81

Microsoft’s More Personal Computing (MPC) division is not the star of the show anymore, but it still brings in more revenue than the company’s other divisions. For the quarter, MPC had revenues up 2% to $12.17 billion, with the growth attributed to gaming and search, although further losses from their failed phone efforts accounted for 2% of revenue loss. The MPC segment had $2.51 billion in operating income for the quarter, which was down 2% from a year ago. Margins for Surface and search were up, but gaming was down due to the expenses related to the launch of the Xbox One X.

Windows OEM Pro revenue was up 11% for the quarter, which Microsoft stated is a couple percentage points ahead of the commercial PC market, which indicates that there’s some growth on the commercial side right now in terms of PC sales. OEM non-Pro declined 5% though, which is a larger decline than the personal PC market. Search revenue was up 15% for the quarter, with both more revenue per-search, and more search volume.

On the gaming side, revenue was up 8% to $3.92 billion, with Xbox hardware revenue up 14% from the launch of the Xbox One X. Xbox software and services grew 4%, with more digital sales in the picture. Microsoft no longer reports Xbox console sales numbers, but they did state that active users of Xbox Live has grown 7% to 59 million, but that’s across their ecosystem and not specific to the console hardware.

Surface didn’t have a spectacular quarter though, with revenue basically flat year-over-year at $1.335 billion. Microsoft’s average selling price was up, but there was a decline in unit sales compared to the same point last year, which is a bit surprising since the company has refreshed it’s product lineup this year, where as a year ago it was still the same devices as launched in November 2015.

Productivity and Business Processes, which includes Office 365, commercial, and consumer, along with Dynamics, and LinkedIn, continues to show strong growth for the company. For this quarter, revenues were up 25% to $8.95 billion. LinkedIn accounted for 15 percentage points of revenue growth for this segment. Operating income was up 9% to $3.34 billion. Office 365 continues to be a huge success, although it’s certainly cannibalizing some of Microsoft’s old business. Office 365 commercial seats were up 30% for the quarter, compared to Q2 2017, and revenue from commercial seats was up 41%. However, the traditional Office sales declined 16% due to this growth in the subscription model. On the consumer side, Office consumer revenue was up 12%, and they now have 29.2 million subscribers. Dynamics revenue was up 10%, with Dynamics 365 up 67%. LinkedIn contributed revenues of $1.3 billion, although that acquisition is also responsible for 33% of their expenses for this segment.

Intelligent Cloud, which includes server and cloud products, as well as enterprise services, had revenues for the quarter of $7.8 billion, which is up 15% from a year ago. Operating income was $2.83 billion, up 24%. Server products continued to grow, up 4% from a year ago, but Azure is the key to this segment, with Azure revenue up 98% from a year ago, which continues a trend of 90+% revenue growth for the last five quarters. Azure compute usage more than doubled over the last year.

Microsoft Q2 2018 Financial Results (GAAP)
  Productivity and Business Processes Intelligent Cloud More Personal Computing
Revenue (in Billions USD) $8.95 $7.80 $12.17
Operating Income (in Billions USD) $3.34 $2.83 $2.51
Revenue Change YoY +25%, +24% CC +15%, +15% CC +2%, +2% CC
Operating Income Change YoY +9%, +10% CC +24%, +24% CC -2%, -2% CC

Despite a large charge for taxes this quarter, it’s clear that Microsoft’s cloud efforts are starting to really pay dividends. For Q3, Microsoft is expecting revenues in the $25.25 to $25.95 billion range.

Source: Microsoft Investor Relations

MSI Announces Immerse GH60 Gaming Headset,  Vigor GK40 Keyboard and Vigor GK40 Combo

MSI Announces Immerse GH60 Gaming Headset, Vigor GK40 Keyboard and Vigor GK40 Combo

MSI this week has announced two new products to add to its gaming peripherals lineup: the Immerse GH60 Gaming Headset, as well as new Vigor GK40 keyboard. Along with that, they have paired the new Vigor Keyboard and existing Clutch GM10 Gaming Mouse together for ease of purchase. MSI’s aim with the new products and combo is to provide more options for the mainstream gamers and include complimentary parts from their product stack into a one-stop solution for a gaming mouse and keyboard.

GH60 Gaming Headset

The Immerse GH60 Gaming Headset is an over the ear type using a solid stainless steel design and flexible suspension headband that is intended to fit many head sizes and have a comfortable fit. Its ear cups swivel for comfort as well as easy carry and storage capabilities. The ear pads are swappable and MSI includes a set of cloth ear cups as well so users are able to choose their preference. Outside of the steel framing, the suspension headband, ear cups, and other structures are black with the familiar MSI Gaming dragon in red on the outside of both ear cups. A gaming headset wouldn’t be complete without a microphone and while it is permanently attached it is retractable and can hide inside the unit when not in use.

Specs wise, the GH60 uses a single 50mm Neodymium driver in each ear cup and yields a frequency response of 20 Hz ~ 40 kHz with an impedance of 32 Ohm. The unidirectional microphone is able to capture frequencies from 100 Hz ~ 10 kHz. Connecting the GH60 to a PC is a 2M braided cable to with a gold plated 3.5” headphone jack at the end. Inline is a remote control offering volume control and muting the microphone.

MSI did not mention the price but it will be available January 2018.

Immerse GH60 Gaming Headset
Connector 3.5mm headphone jack
Cable Gold Plated and Braided / 2M Length / Low Resistance
Driver 50mm Neodymium
Speaker Sensitivity (SPL) 96 dB ± 3 dB
Speaker Impedance 32 Ω
Speaker Frequency Response 20 Hz ~ 40 kHz
Pick-Up Pattern Unidirectional
Microphone Frequency Response 100 Hz ~ 10kHz
Microphone Sensitivity -40 dB ± 3 dB
Microphone Impedance 2.2k Ω

Vigor GK40 and GK40 Combo with Clutch GM10 Gaming Mouse

MSI has also launched the new Vigor GK40 Gaming Keyboard that features ‘mechanical-like’ keystrokes from a membrane-based keyboard. The GK40 is a full sized keyboard including a number pad and a large palm rest for comfortable gaming. The keys have anti-ghosting capability with up to 20 keys for a conflict-free gaming experience. The keyboard is also water repellant hopefully preventing damage from the inevitable spill on the keyboard. It has multi-color backlit keys with four levels of brightness adjustment, and eight different light effects across six regions which can all be controlled through their Mystic Light application.

The GM10 Gaming Mouse is an unassuming device by mouse standards is a four-button device with a web wheel and on-the-fly DPI adjustment buttons along with the two standard. It has an asymmetric design and dragon scale anti-slip grip is made for right-handed users, though it looks like a lefty could be OK with it as the design doesn’t look too asymmetric and awkward.

The Pixart ADSN-5712 optical sensor has four built-in instant DPI settings, 800/1000(default)/1600/2400, which can be set without software. While the main key switches are not listed but are said to provide 10 Million+ clicks. The integrated LEDs are found in the web wheel (up to four colors) and the Red Dragon. The Dragon logo has a breathing effect while the web wheel color matches the DPI (blue, red, green, and purple). The GM10 connects to the PC via a 1.8m USB cable.

MSI has grouped the GK40 keyboard and GM10 mouse into one package in order to simplify the purchase of a gaming keyboard and mouse. The packaging will show Vigor GK40 Combo on it as well as picture the mouse to discern itself from just the keyboard package itself which looks remarkably similar. 

No mention of pricing but these I’d expect the combo to be relatively inexpensive since it is geared towards the mainstream and isn’t a mechanical keyboard or fancy RGB multi-button mouse. These are also said to be available in January.

Vigor GK40 Keyboard
Model Vigor GK40 Gaming Keyboard
Main Key Switches Membrane switches (Mechanical-like)
Keyboard Interface USB
Normal Keys Stand 104 keys / 105 keys / 108 keys
Dimensions (mm) 472 x 207 x 39
Windows Support / Requirements Windows 10 / 8.1 / 8 / 7 – System with USB Support
Backlight 6-region RGB illumination, supports MSI Mystic Light
Weight 1056g
Clutch GM10 Gaming Mouse
Sensor PixArt ADSN-5712
Sensor Type Optical
DPI Switch 800 / 1000 (default) / 1600 / 2400
Color Black
Buttons 4
Response Time 1ms
Main Key Switches 10 Million+ clicks
LED Light Red Dragon LED / Wheel (four colors)
Lighting Effects Logo LED: Breathing effect
Wheel LED: by DPI (800 Blue / 1000 Red / 1600 Green / 2400 Purple)
Cable / Interface 1.8m / USB
Dimensions (mm) / Weight (G) 125 x 64 x 42 / 104g
Operating System Windows 10 / 8.1 / 8 / 7 / Vista / XP

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TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020

TSMC Starts to Build Fab 18: 5 nm, Volume Production in Early 2020

TSMC last week held a groundbreaking ceremony for its Fab 18 phase 1 production facility. The fab will produce chips using TSMC’s 5 nm process starting from early 2020. When all three phases of the manufacturing facility are completed, its wafer starts capacity will exceed one million 300-mm wafers per year, comparable with other three GigaFabs operated by TSMC.

TSMC’s Fab 18 will be located in Tainan (in the Southern Taiwan Science Park), and will be built in three phases. The construction of the first phase or segment of the building will be completed in about a year from now, after which TSMC will move in equipment sometime in early 2019. In about two years from now, the company expects to start volume production of chips using its 5 nm process technology at the Fab 18/phase 1. Construction of the second and the third phases will commence in Q3 2018 and Q3 2019. The two phases will start volume production in 2020 and 2021, respectively.

TSMC’s Fab 18: Milestones
  Phase 1 Phase 2 Phase 3
Construction Start Early 2018 Q3 2018 Q3 2019
Equipment Move-In Early 2019 ? ?
High-Volume Manufacturing Start Early 2020 2020 2021

The Fab 18 will have a total floor area of 950,000 square meters and its cleanroom area will exceed 160,000 square meters, the contract maker of semiconductors said. TSMC estimates that the combined production capacity of all three phases of the Fab 18 will exceed one million 300-mm wafer starts per year, which is comparable to the capacities of the other GigaFabs that TSMC operates — Fab 12, Fab 14, and Fab 15. It is noteworthy that the planned floor area and cleanroom space of the Fab 18 will be significantly larger than the initially planned floor and cleanroom area of the Fab 15, which emphasizes increasing complexity of IC manufacturing these days as well as increasing orders from TSMC’s clients.  In total, the Fab 18 will cost TSMC NT$500 billion ($17.08 billion), making it one of the most expensive chip manufacturing facilities in the world.

Brief Comparison of TSMC’s Fab 15 and Fab 18
  Fab 15 Fab 18
Total Area of Site 18.4 hectares ?
Building Area 430,000 m² 950,000 m²
Clean Room Space* 104,000 m² 160,000 m²
Initially Expected Investment** NT$300 billion
~$9.375 billion
NT$500 billion
~$17.08 billion
Groundbreaking July 2010 January 2018
Notes *Fabs are usually upgraded over time, today’s cleanroom space of the Fab 15 may be larger than initially projected.
**Initially expected investments tend to change over time.

Besides its dimensions and cost, there is another reason why Fab 18 is important for the semiconductor industry: it will be one of the world’s first facilities to produce chips using a 5-nm production tech. TSMC yet has to detail its 5 nm manufacturing technology, but from the announcements that the company has made so far it is evident that this fabrication process will rely significantly on EUV lithography. TSMC did not mention EUV at all in its press release, which is a bit strange. Meanwhile, over the course of last year the semiconductor manufacturer did mention that the 5 nm fabrication technology would be its second-gen EUV process, which means usage of EUV for more more layers when compared to the CLN7FF+ (its advanced 7 nm tech). Furthermore, TSMC already has functional SRAM cells made using its CLN5FF technology and the yields were satisfactory in mid-2017. Therefore, the 5 nm development process seems to be going on relatively well.

The extended usage of EUV for 5-nm chip production means that the company will need to install more EUV tools into the Fab 18, which is one of the reasons why it needed to expand the fab’s cleanroom space. The fact that TSMC has begun to build Fab 18 indicates that the contract maker of chips is confident in its 5 nm technology as well as EUV equipment, including ASML’s TWINSCAN NXE scanners, Cymer’s EUV light sources and other tools. This confidence is further underscored by their intention to start high-volume manufacturing of 5-nm devices in Fab 18 in early 2020.

Advertised PPA Improvements of TSMC’s CLN7FF Nodes
Data announced by TSMC during conference calls, press briefings and in press releases
  7FF
vs
16FF+
7FF
vs
10FF
7FF EUV
vs
7FF
5FF EUV
vs
7FF EUV
Power 60% <40% 10% lower
Performance 30% ? lower higher
Area Reduction 70% >37% ~10% tangible
HVM Start ~Q2 2018 ~H2 2019 H1 2020

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Sources: TSMC (1, 2, 3, 4)

JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features

JEDEC Publishes UFS 3.0 Spec: Up to 2.9 GB/s, Lower Voltage, New Features

JEDEC this week published their UFS 3.0 specification, which is intended to bring numerous performance, power and feature set-related improvements to the standard. The version 3.0 of the spec doubles the per-lane performance of an eUFS device to 11.6 Gbps, which increases the peak data transfer rate of a storage device to 23.2 Gbps. At the same time, the new standard introduces a 2.5 V VCC power supply mode that enables lower power consumption and support for the latest types of NAND. Finally, the UFS 3.0 spec contains features designed specifically for automotive applications that enable standard support for extended temperature ranges as well as “refresh” operation to boost reliability.

One of the key improvements of the UFS 3.0 (JESD220D) specification is the usage of MIPI’s M-PHY 4.1 physical layer as well as the recently released MIPI UniPro 1.8 protocol to form the interconnect layer (IL). The new IL supports data rates of up to 11.6 Gbps (HS-Gear4) per lane as well as QoS features to enable a more reliable link through monitoring and training of the communication channel. All UFS 3.0-compatible devices are required to support HS-G4 (11.6 Gbps) and HS-G3 (5.8 Gbps), which means that they all will be faster than UFS 2.0/2.1-compliant devices that do not necessarily support HS-G3. UFS 3.0 storage devices will continue to feature up to two full-duplex lanes, which means a theoretical maximum bandwidth of up to 23.2 Gbps (2.9 GB/s) when HS-G4 is used. The MIPI M-PHY 4.1 standard continues to use 8b10b line encoding, so accounting for the encoding overhead, the actual achievable bandwidth by an embedded UFS device will be considerably lower than the theoretical one — 15 Gbps (1.875 GB/s) is something that is reasonable to expect.

The upcoming eUFS 3.0 storage devices will require three different power rails: 1.2 V for VCCQ, 1.8 V for VCCQ2, as well as 2.5 V/3.3 V for VCC. The addition of 2.5 V for VCC is to enable support for the latest and upcoming generations of NAND flash with higher bit densities (including 3D NAND with higher amounts of layers as well as 3D TLC NAND).

The UFS 3.0 standard also supports a number of features particularly suitable for the automotive industry. UFS 3.0 devices may support a native predefined low/high temperature event notification which will simplify development of UFS-based automotive applications. Extended temperature ranges (-40°C, 105°C) will be optionally supported by host controllers. Furthermore, the latter might also adopt a standard “refresh” function to extend data retention by moving data from cell to cell to keep charges at sufficient levels.

Another important innovation of the UFS 3.0 spec is enhanced support for RPMBs (replay protected memory block). The new standard supports multiple RPMBs with multiple RPMB keys. Furthermore, RPMB regions can now be configured at manufacturing, simplifying their usage for device makers.

To simplify development of UFS-based applications going forward, JEDEC also released JESD223D —  a functional specification of a UFS host controller interface (UFSHCI). This spec defines features and registers that have to be supported by UFS 3.0 host controllers and enable usage of a standard driver for all applications featuring UFS 3.0-compatible storage devices.

The UFS 3.0 standard greatly speeds up performance and capacity of storage subsystems inside smartphones, tablets, media players, VR headsets, automotive and other applications that are going to use it. Meanwhile, it is not clear when this might happen. There is at least one company who has been offering UFS 3.0 controllers since Q2 2017, but it looks like the latest mobile SoCs from Qualcomm, HiSilicon, MediaTek and Samsung do not support the new spec. That said, expect applications based on the new standard to be released in the coming years, just not in 2018.

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