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Micron Readies 3D QLC NAND-Based Datacenter SSDs for Nearline Storage

Micron Readies 3D QLC NAND-Based Datacenter SSDs for Nearline Storage

Micron has revealed plans to release datacenter-class SSDs based on 3D QLC NAND memory in an effort to compete in the nearline storage market. Briefly announced at a conference last week, the company is taking aim at applications that currently use 7200 RPM HDDs, the use of which is increasingly common in nearline storage. The manufacturer did not reveal any additional details about the upcoming drive, but demonstrated a wafer with QLC 3D NAND dies.

Micron disclosed its plans concerning own-brand SSDs in 2018 at the A3 Technology Live conference in London last week. Among other things, the company intends to introduce a QLC-based SSD with a SATA interface for cloud datacenters this year. The drive will be positioned below the existing 5200-series SSDs and will be aimed primarily at read intensive applications (or the so-called WORM — write once, read many workloads). The QLC-based SSD will have a feature set aimed at hyperscale datacenters and will compete for the place currently occupied by high-capacity 7200 RPM HDDs, reports The Register.

The manufacturer did not disclose capacity of the upcoming QLC-based drives and did not reveal whether they will feature in-house developed controllers with enhanced ECC capabilities (developed using IP and engineers the company got when it acquired Tidal Systems several years ago), or third-party enterprise-grade controllers. The company demonstrated a wafer carrying 64 GB (i.e., 512 Gb) 3D QLC NAND chips, indicating that it has the new flash memory at hand already.

QLC flash memory stores four bits per cell, thus offering a 33% higher bit density and lower per-bit cost compared to TLC flash commonly used for high-capacity SSDs today. 3D QLC NAND has been formally announced by Toshiba and Western Digital so far, but there are no doubts that all producers of NAND are working on QLC chips too. Increasing the bit density of NAND flash usually comes at the cost of endurance, but Toshiba last year said that it had managed to increase endurance of its 3D QLC NAND flash to 1000 program/erase cycles by using a stronger ECC mechanism, which is comparable to endurance of 3D TLC NAND.

QLC’s higher bit densities as well as lower per-bit costs are expected to reduce per-GB prices of high-capacity SSDs further and enable them to compete against existing leading-edge HDDs, such HGST’s Ultrastar with 12 or 14 TB capacity. Two obvious advantages that high-capacity QLC-based SSDs will have when compared to hard drives are lower latencies and higher storage densities. Meanwhile, per-GB costs of HDDs will remain lower when compared to NAND flash for years to come — this is what producers of both HDDs and flash memory agree on. So I’d expect to see that these upcoming 3D QLC NAND-based SSDs will sit between high-capacity HDDs and high-performance SSDs, occupying a tier of their own in hyperscale datacenters.

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Sources: The Register, A3 Communications Technology Live

AMD Readies Ryzen 3 2200GE & Ryzen 5 2400GE APUs with Reduced TDP

AMD Readies Ryzen 3 2200GE & Ryzen 5 2400GE APUs with Reduced TDP

AMD is preparing to release low-power versions of its Ryzen APUs with built-in Radeon Vega graphics. The new Ryzen 3 2200GE and Ryzen 5 2400GE chips will have a 35 W TDP and will operate at lower frequencies when compared to the Ryzen 3 2200G and the …

VAIO S Laptops Updated With 8th Gen Core CPUs & TruePerformance to Prolong Turbo Time

VAIO S Laptops Updated With 8th Gen Core CPUs & TruePerformance to Prolong Turbo Time

VAIO has updated its popular 13-inch VAIO S laptops sold in the U.S. with Intel’s latest 8th Generation Core i5/i7 processors featuring four cores. Besides new CPUs, the systems have also added the company’s new TruePerformance technology, which is designed to maintain a higher turbo boost frequency for longer periods of time. The new VAIO S also feature a fingerprint reader and a TPM 2.0 module, emphasizing their business nature. Meanwhile the 2018 VAIO S retain their “classic” chassis along with a set of connectors, so they do not support modern headers, such as USB Type-C.

The new VAIO S laptops are based on Intel’s quad-core Core i5-8250U or Core i7-8550U processors with Intel UHD Graphics 620 accompanied by 8 – 16 GB of LPDDR3-1866 memory and a PCIe SSD featuring 256 GB, 512 GB or 1 TB capacity. One of the key features of the 2018 VAIO S notebooks is the TruePerformance technology that promises to maximize time that a CPU works at increased frequencies, giving VAIO a competitive advantage over other laptops based on the same processor.

VAIO’s TruePerformance tech is a combination of VAIO’s increased CPU power limits and a cooling system that can handle the increased heat. For reference, Intel’s Turbo Boost 2.0 technology increases the CPU frequency in increments of 100 MHz when an operating system requests a higher performance state. Typically, the amount of time that a CPU can work at its maximum Turbo Boost 2.0-defined frequency is about 20 to 30 seconds (according to VAIO), then it has to reduce its clocks because of thermals and other factors. VAIO claims that even if it increased the amount of time a processor operates at its TB 2.0-defined peak to 40 seconds, this would not bring many benefits to end users.

Instead, engineers from VAIO increased the base TDP limits of Intel CPUs to prolong the amount of time the chips operate at an above-nominal frequency (or frequencies), but below the TB 2.0-defined peak frequency. The company does not say whether it boosted TDP of Intel’s 8th Generation Core i5/i7 CPUs all the way to  25 W from 15 W (an increase allowed by Intel and called configurable TDP-up) which would explain and define higher frequencies. Meawhile, VAIO admits it needed to redesign its CPU VRMs as well as its cooling system to remove the extra heat. The new cooler has a thicker vent (and probably an enlarged radiator) as well as apply a new fan rotation speed control algorithm to ensure that the chips do not overheat.

Based on graphs demonstrated by VAIO, its TruePerformance technology can increase a CPU performance in Cinebench by 11% ~ 13% when compared to the same CPU without the tech. Meanwhile, the increased TDP limit can also lift iGPU performance by 4.5% ~ 8.6%. While performance increases are not radical, they add value to VAIO’s new PCs.

Now, back to the laptops themselves. This year’s VAIO S systems are outfitted with a 802.11ac Wi-Fi + Bluetooth 4.1 module, a GbE connector, a 0.92 MP webcam, an SD card reader, a fingerprint reader, a TPM 2.0 module and so on. Configuration of I/O ports remains unchanged from the original (non-Sony) VAIO S model launched in 2016: three USB 3.0 ports (including one always-on USB 3.0 for charging), a TRRS audio connector, an HDMI and a D-Sub output. When it comes to battery life, the new model S can work for approximately 8 hours 45 minutes on one charge, depending on the model and usage, which is in line with previous-gen VAIO S systems, but is hardly impressive when compared to other modern laptops.

As for display and physical dimensions, the new VAIO S features a 13.3” screen with a 1920×1080 resolution, it weighs just about a kilogram (2.34 lbs) and is only 15 – 17.8 mm thick. When compared to the 2016 VAIO S, the chassis got ~1.8 mm thicker at its thinnest point and ~0.2 mm thinner at its thickest point, which is hardly a big deal for portability.

The VAIO S 2018 at a Glance
  VJS132X0611S VJS132X0511S VJS132X0411S VJS132X0311S
Display Size 13.3″
Type IPS
Resolution 1920×1080
CPU SKU Core i5-8250U Core i7-8550U
Cores/Threads 4C/8T
Cache 6 MB 8 MB
Frequency Base 1.6 GHz 1.8 GHz
cTDP-up 1.8 GHz (?) 2 GHz (?)
Turbo 3.4 GHz 4 GHz
TDP TDP 15 W
  cTDP-up 25 W (?)
GPU SKU Intel HD Graphics 620 (GT2)
24 EUs, Gen 9
Base 300 MHz
Turbo 1.1 GHz 1.15 GHz
DRAM 8 GB LPDDR3-1866 16 GB LPDDR3-1866
SSD 256 GB PCIe 512 GB PCIe 1 TB PCIe
USB 3 × USB 3.0 Type-A (one w/charge)
Card Reader SD card reader
Wi-Fi 2×2 802.11ac
Bluetooth 4.1
Ethernet GbE
Display Outputs D-Sub
HDMI
Audio Stereo Speakers
Microphone
TRRS audio jack for headsets
Webcam 0.92 MP webcam
Fingerprint Reader Yes
Battery Life 8 hours 45 minutes
Dimensions Width 12.61″ | 32 cm
Depth 8.53″ | 21.66 cm
Thickness 0.59″ – 0.7″ | 15 – 17.8 mm
Weight 2.34 lbs | 1.06 kg
Colors Silver
Price at Launch $1,199 $1,599 $1,899 $2,199

The new VAIO S will be available in the U.S. this month at MSRPs starting from $1,199. It is noteworthy that in Japan VAIO offers two business-oriented VAIO S lineups — with 11.6” and 13.3” displays (there is also a family with a 15.5” screen, but it is barely aimed at business customers). Both VAIO S11 and S13 are based on Intel’s latest quad-core Core i5/i7 8000-series processors, come with optional LTE modems and even feature spill-resistant keyboards that are never mentioned in case of the U.S. VAIO S 2018.

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AM4 Motherboard BIOS Updates Released to Support AMD Ryzen APUs

AM4 Motherboard BIOS Updates Released to Support AMD Ryzen APUs

AMD’s Ryzen CPUs made a large impact on the market starting around mid-2017 when they were released. When Ryzen based CPUs hit the scene, performance was on generally on par or better than its Intel counterparts and pricing was notably better for the same thread count. This was a dramatic change from previous generations and brought competition back to the CPU market. Fast forward to today and AMD’s new Ryzen-based APUs are being released – the Raven Ridge-based Ryzen 5 2400G and Ryzen 3 2200G – which merge AMD’s Vega GPU architecture along with Ryzen CPU. 

With this latest release of what AMD is calling their 2000-series processors, existing X370, B350, and A320 based motherboards will require a BIOS update for proper support of the new APUs. As a result, all of the major board partners have released updates for their respective lineups to include AMD’s AGESA 1.1.0.1 microcode, allowing existing boards to fully support these new APUs.

In accordance with this latest round of updates, we have compiled a list from four major OEMs of all the updated BIOS versions below. Missing is Biostar who did not make any announcements. We checked the website and as of today, they have not released new BIOSes for their AM4 boards which include the AGESA 1.1.0.1 update supporting these APUs. 

EDITOR’S NOTE: Biostar announced its support list 2/12 after publication. It has been added below.

 

MSI

MSI distributed a press release a couple days ago on its website. These can be found at the motherboard’s site and the support section.

MSI X370 Motherboards
Name PCB Version BIOS Version
X370 XPower Gaming Titanium 1.1 E731AMS.1C0
X370 Gaming M7 ACK 1.1 E7A35AMS.150
X370 Gaming Pro Carbon AC 1.1 E7A32AMS.280
X370 Gaming Pro Carbon 1.1 E732AMS.1C0
X370 Krait Gaming 1.0 / 1.1 E7A33AMS.190
X370 Gaming Pro 2.0 / 2.1 E733AMS.480
X370 SLI Plus 2.0 / 2.1 E7A33AMS.390
X370 Gaming Plus 3.0 E7A33AMS.580
B350
B350 Gaming Pro Carbon 1.1 E7B00AMS.190
B350 Krait Gaming 1.0 E7B08AMS.180
B350 Tomahawk Plus 1.2 E7B36AMS.180
B350 Tomahawk 1.0 E7A34AMS.1C0
B350 Tomahawk Arctic 3.0 E7A34AMS.HA0
B350 Gaming Plus 4.0 E7A34AMS.M70
B350M Mortar 1.1 E7A37AMS.1B0
B350M Mortar Arctic 2.1 E7A7AMS.AA0
B350M Bazooka 1.0 E7A38AMS.1A0
B350M Gaming Pro 1.0 E7A39AMS.2C0
B350 PC Mate 2.0 E7A34AMS.AA0
B350M Pro-VD Plus 1.1 E7B38AMS.250
B350M Pro-VDH 2.0 E7A38AMS.A90
B350I-S01 1.1 E7A40AMS.230
B350I Pro AC 1.1 E7A40AMS.110
B350M Pro-VH Plus 1.0 E7B07AMS.250
A320
A320M Gaming Pro 1.0 E7A39AMS.190
A320M Bazooka 1.0 E7A38AMS.280
A320M Grenade 3.0 E7A39AMS.A80
A320M Pro-VD/S 1.0 E7A36AMS.270
A320M Pro-VH Plus 1.0 E7B07AMS.360
A320M Pro-VHL 1.0 E7B07AMS.160
A320M Pro-VD Plus 1.0 E7B38AMS.310
A320M Pro-VD Plus 1.1 E7B38MAS.150

 

Asus

Asus also sent out an official announcement on their new BIOSes. The Asus website lists them as well as instructions on how to update. The X370 Crosshair motherboards are able to flash via BIOS Flashback or EX Flash 3 while the rest of the of the boards will use the more traditional EX Flash 3. 

Asus X370 Motherboards
Name BIOS Version
ROG Crosshair VI Extreme 3502
ROG Crosshair VI Hero (Wi-Fi AC) 3502
ROG Crosshair VI Hero 3502
ROG Strix X370-F Gaming 3803
ROG Strix X370-I Gaming 3803
Prime X370-Pro 3803
Prime X370-A 3803
B350
ROG Strix B350-F Gaming 3803
ROG Strix B350-I Gaming 3803
TUF B350M-Plus Gaming 3803
Prime B350-Plus 3803
Prime B350M-A 3803
Prime B350M-E 3803
Prime B350M-K 3803
B350M-Dragon 3803
A320
Prime A320M-C  R2.0 3803
Prime A320M-A 3803
Prime A320M-E 3803
Prime A320M-K 3803
EX-A320M-Gaming 3803

 

ASRock

ASRock also made an announcement, however, it was only on their Japanese website or via email to the press. Since that was published, additional BIOSes have already been released and are listed below.

ASRock X370 Motherboards
Name BIOS Version
X370 Taichi 4.40
X370 Killer SLI/AC 4.50
X370 Killer SLI 4.50
Fatal1ty X370 Professional Gaming 4.40
Fatal1ty X370 Gaming K4 4.50
Fatal1ty X370 Gaming X 4.50
Fatal1ty X270 Gaming-ITX/AC 4.40
B350
AB350 Pro4 4.50
AB350M Pro4 4.50
AB350M 4.40
AB350M-HDV 4.40
Fatal1ty AB350 Gaming-ITX/AC 4.40
Fatal1ty AB350 Gaming K4 4.60
A320
A320M Pro4 4.50
A320M 4.40
A320M-DGS 4.40
A320M-HDV 4.40

 

GIGABYTE

GIGABYTE did not have an official announcement but are listed on the website for all AM4 motherboards. 

GIGABYTE X370 Motherboards
Name BIOS Version
GA-AX370M-Gaming 3 F20
GA-AX370M-DS3H F20
GA-AX370-Gaming K7 F20
GA-AX370-Gaming K5 F20
GA-AX370-Gaming K3 F20
GA-AX370-Gaming 5 F20
GA-AX370-Gaming 3 F20
GA-AX370-Gaming F20
B350
GA-AB350M-Gaming 3 F20
GA-AB350N-Gaming WiFi T20h
GA-AB350M-DS3H F20
GA-AB350M-D3V F20
GA-AB350M-HD3 F20
GA-AB350M-DS2 F20
GA-AB350-D3H F20
GA-AB350-Gaming 3 F20
GA-AB350-Gaming F20
A320
GA-A320M-S2H F20
GA-A320MA-M.2 F20
GA-A320M-D2P F20
GA-A320M-DS2 F20
GA-A320M-HD2 F20
GA-A320-DS3 F20

 

Biostar

Biostar announced their support through the Taiwan website

Biostar X370 Motherboards
Name BIOS Version
Racing X370GT7 F12
Racing X370GT5 F12
Racing X370GT3 F12
Racing X370GTN F12
B350
Racing B350GT5 F12
Racing B350GT3 F12
Racing B350GTN F12
Racing B250ET2 F12
TB350-BTC F12
A320
TA320-BTC F12
A320MH Pro F12
A320MD Pro F12

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