The vast majority of laptops nowadays use solid-state drives, which is why the development of new, higher-capacity 2.5-inch hard drives has all but come to a halt. Or rather, it almost has. It seems that the 2.5-inch form factor has a bit more life left in it after all, as today Western Digital has released […]
With all the new fabs being built in Germany and Japan, as well as the expansion of production capacity in China, TSMC is planning to extend its production capacity for specialty technologies by 50% by 2027. As disclosed by the company during its European Technology Symposium this week, TSMC expects to need to not only […]
As modern high-performance CPUs generate more heat, there’s been a noticeable increase in the demand for powerful air coolers capable of managing these thermal challenges. Traditional stock air coolers, while sufficient for regular use, are typically designed to be cheap and relatively compact, leaving further improvements to noise control and peak cooling efficiency on the […]
Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won’t be business as usual; chip manufacturers are going to need to adopt […]
As part of the second leg of TSMC’s spring technology symposium series, the company offered an update on the state of its 3nm-class processes, both current and future. Building on the back of their current-generation N3E process, the optical shrink of this process technology, N3P, is now on track to enter mass production in the […]